1 / 4 www.asb.co.kr november 2008 p lerow tm aln0223 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount m odule package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 215 231 gain db 34 35 gain flatness db ? 0.2 ? 0.4 noise figure db 0.80 0.85 output ip3 (1) dbm 36 37 s11 / s22 (2) db - 20 / - 20 output p1db dbm 20 21 switching time (3) ? sec - supply current ma 160 180 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 13wx13lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 8 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 3 rf in 8 rf out 10 +vcc other s ground ou t line drawing (unit: mm) feature s s 21 = 35.2 db @ 215 mhz = 34.8 db @ 231 mhz nf of 0.80 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current c o u pl er note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more in form a tion description c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type aln0223 asb inc. (top view) (bottom view) solder stencil area ? 0.4 plated thru holes to ground plane plerow (side view) (recommended footprint) specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 233 mhz, z o.sys = 50 ohm
2 / 4 www.asb.co.kr november 2008 p lerow tm aln0223 internally matched lna module s - param e ters noise figure oip3 p1db 215~231 mhz +5 v typical performanc e (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr november 2008 p lerow tm aln0223 internally matched lna module item vol t age s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) cu rrent (ma) 4.5 - 24.14 - 30.47 34.69 0.30 0.734 20.39 36.27 122 4.6 - 25.18 - 30.11 34.80 0.29 0.752 20.54 36.81 128 4.7 - 26.34 - 29.86 34.91 0.28 0.788 20.78 37.11 135 4.8 - 27.51 - 29.67 35.01 0.28 0.749 20.97 37.47 141 4.9 - 28.61 - 29.84 35.11 0.28 0.721 2 1.20 37.81 148 5.0 - 30.02 - 29.55 35.19 0.28 0.750 21.35 38.01 154 5.1 - 31.41 - 29.40 35.28 0.28 0.727 21.57 38.08 160 5.2 - 33.14 - 29.09 35.36 0.29 0.724 21.78 38.08 166 5.3 - 34.71 - 29.28 35.44 0.28 0.753 21.93 38.14 173 5.4 - 36.52 - 29.18 35.51 0.28 0.7 54 22.03 38.22 180 5.5 - 38.95 - 29.00 35.58 0.29 0.777 22.20 38.15 186 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 28.18 - 32.38 35.37 0.25 0.666 21.60 38.97 154 - 20 ? c - 34.47 - 31.12 35.33 0.25 0.684 21.61 38.80 156 0 ? c - 36.19 - 29.92 35.28 0.27 0.738 21.60 38.14 156 25 ? c - 31.25 - 29.54 35.24 0.28 0.765 21.49 37.95 157 40 ? c - 28.55 - 29.77 35.19 0.29 0.796 21.40 38.22 155 60 ? c - 25.77 - 29.52 35.12 0.30 0.822 21.24 38.23 153 80 ? c - 23.74 - 29.76 35. 05 0.30 0.880 21.20 38.09 151 100 ? c - 21.97 - 29.33 34.95 0.28 0.907 21.10 38.04 151 rf performance with voltage change rf performance with operating temperature
4 / 4 www.asb.co.kr november 2008 p lerow tm aln0223 internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r min ed by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included insi de the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. application circuit recommended soldering reflow process evaluat ion board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln series C 13x13mm)
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